Discharge Melting Type Optical Component Mounting System
Discharge Melting Type Optical Component Mounting System
Implementation solution for a new concept optical device using discharge bonding.
- Company:プレサイスゲージ
- Price:Other
1~3 item / All 3 items
Discharge Melting Type Optical Component Mounting System
Implementation solution for a new concept optical device using discharge bonding.
Consulting for the introduction of factory equipment and robots! We deliver equipment that meets on-site needs.
DeaL Sense Co., Ltd. provides consulting services to introduce appropriate equipment that meets our customers' needs from leading manufacturers both domestically and internationally. Leveraging the unique know-how that DeaL Sense has gained from building production lines across various industries, we propose suitable equipment. Please feel free to contact us for inquiries or orders regarding factory equipment. 【Selected Manufacturers Related to Implementation】 ■ Aitec Tektron ■ Komatsu Electronics ■ Japan Unix ■ Seitech ■ Nagaoka Manufacturing *For more details, please refer to the PDF materials or feel free to contact us.
For small and medium devices! Industry-leading performance in flip chip bonding.
The "AFM-15" is a flip chip mounting system ideal for small to medium-sized devices. We have identified the needs of production sites from the customer's perspective and turned them into products. This system realizes ideals such as high speed, high reliability, space-saving, and low cost. Additionally, we also offer the "MDM-50," which is optimal for high-precision, small-quantity, and quantitative coating applications. 【Features】 ■ High speed ■ High reliability ■ One of the smallest device sizes in the industry ■ Low-energy bonding ■ Compatible with 12-inch wafer supply *For more details, please refer to the catalog or feel free to contact us.